Manufacturing Capabilities

Quality and reliability are considered as the foundation of today's highly sophisticated military defense-aerospace systems, satellites, computers and high-end telecommunications equipment. Halcyon recognizes these facts and has evolved a strong commitment to the highest quality reliability manufacturing processes.

  • All assembly, testing and laser trimming from prototype to high volume production are performed in modern automated Class 10,000 clean room.
     
  • Eight high speed ESEC auto bonders for reliable, fast assembly, in production quantities.

     
  • K&S 4500 Series for Aluminum, and Gold wire bonding. Wedge, Ball, and Ribbon Bonds
     
  • Expertise in millimeter wave HYBRIDS, POWER MICROWAVE MODULE SOLDERING, and PACKAGING.
     
  • All Halcyon associates are fully trained in every assembly step, and committed to providing defect-free products and services on schedule every time.
  • Components and work-in-process are stored in grounded, nitrogen dry boxes.

Manufacturing Capabilities

Assembly Capability

Packaging Capability
 
  • Surface Mount Technology
  • Multi-layer Thick Film Substrates
  • Hermetic Sealing
  • Aluminum Wire Bonding
  • Gold Wire Bonding
  • Eutectic, Epoxy, Polyamide, and Solder Attachment
  • Ball Grid Array
  • Custom IC Packaging
  • Hybrids
  • MCMs
  • Multi-Chip Modules
  • IC Packaging
  • Custom Semiconductor Packaging
  • Power Microwave Modules