Quality and reliability
are considered as the foundation of today's highly sophisticated military
defense-aerospace systems, satellites, computers and high-end telecommunications
equipment. Halcyon recognizes these facts and has evolved a strong commitment
to the highest quality reliability manufacturing processes.
- All assembly, testing
and laser trimming from prototype to high volume
production are performed in modern automated Class 10,000 clean room.
- Eight high speed ESEC auto bonders for reliable, fast assembly, in production quantities.
- K&S 4500 Series for Aluminum, and Gold
wire bonding. Wedge, Ball, and Ribbon Bonds
- Expertise in millimeter wave
HYBRIDS, POWER MICROWAVE MODULE SOLDERING, and PACKAGING.
- All Halcyon associates
are fully trained in every assembly step, and
committed to providing defect-free products and services on schedule
- Components and
work-in-process are stored in grounded, nitrogen dry boxes.
Thick Film Substrates
- Gold Wire
Epoxy, Polyamide, and Solder Attachment
- Ball Grid
- Custom IC
- IC Packaging
- Custom Semiconductor