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Phoenix Microelectronics, Inc. |
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The Best Assembly Anywhere |
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Manufacturing |
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Manufacturing Capabilities |
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Quality and reliability are considered as the foundation of today's highly sophisticated military defense-aerospace systems, satellites, computers and high-end telecommunications equipment. Phoenix recognizes these facts and has evolved a strong commitment to the highest quality reliability manufacturing processes. |
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· All assembly, testing and laser trimming from prototype to high volume production are performed in modern automated Class 10,000 clean room. · Six high speed ESEC auto bonders for reliable, fast assembly, in production quantities. · Experienced in Aluminum, and Gold wire bonding. Wedge, Ball, and Ribbon Bonds · Expertise in millimeter wave hybrids, and packaging. · All Phoenix associates are fully trained in every assembly step, and committed to providing defect-free products and services on schedule every time. · Components and work-in-process are stored in grounded, nitrogen dry boxes
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· Surface Mount Technology · Multi-layer Thick Film Substrates · Hermetic Sealing · Aluminum Wire Bonding · Gold Wire Bonding · Eutectic, Epoxy, Polyamide, and Solder Attachment · Ball Grid Array |
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Assembly Capability |
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Packaging Capability |
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· Custom IC Packaging · Hybrids · MCMs · Multi-Chip Modules · IC Packaging · Custom Semiconductor Packaging |
