Packaging

Our stockroom contains hundreds of package styles and sizes.  Our suppliers, like Chelsea Technologies, allows us to acquire inventories with overnight reliability.

A broad range of package sizes, types, shapes and materials are available. From plug-in style to flat packs and chip carriers, they can be made of kovar, cold rolled or stainless steel, molybdenum, copper, ceramic or a combination. A variety of finishes are also possible, including gold or nickel.

Available packaging technologies include:

  • Multi-Chip Modules
  • Hybrids
  • Chip-On-Board
  • DWDM Modules
  • MCM-L and MCM-D
  • Optoelectronics Packages
  • Custom Tooling within hours.